(DOWNLOAD) "Characterization of Integrated Circuit Packaging Materials" by Thomas Moore " eBook PDF Kindle ePub Free

eBook details

Title: Characterization of Integrated Circuit Packaging Materials
Author : Thomas Moore
Release Date : January 01, 2010
Genre: Engineering,Books,Professional & Technical,
Pages : * pages
Size : 13408 KB

Description

With a particular emphasis on fabrication quality control, this volume in the Materials Characterization series focuses on characterization techniques used for critical junctures in package design like mold compound adhesion and strength, mechanical stress, moisture sensitivity, solderability of IC components, and interconnect systems. Readers will find: -- General overview of IC package reliability testing -- Characterization for the electrical performance of IC packages -- Understanding surface characteristics and interfaces for thermal management -- Concise summaries of major characterization technologies for integrated circuit packaging materials, including acoustic microscopy, atomic absorption spectrometry, Auger Electron Spectroscopy, Energy-Dispersive X-Ray Spectroscopy, and many more.